FEATURES High efficiency: 90.5% @ 15V/4.4A Size: 33.0 x 22.9 x 9.5 mm (1.30”x0.90”x0.37”) Industry standard footprint and pinout
DS_V48SR15004_06122007 10 THERMAL CONSIDERATIONS Thermal management is an important part of the system design. To ensure proper, reliable operati
DS_V48SR15004_06122007 11 PICK AND PLACE LOCATION RECOMMENDED PAD LAYOUT (SMD) SURFACE-MOUN
DS_V48SR15004_06122007 12 LEADED (Sn/Pb) PROCESS RECOMMEND TEMP. PROFILE Time ( sec. ) Pre-heat temp. 140~180°C 60~120 sec. Peak temp. 210~230°C
DS_V48SR15004_06122007 13 MECHANICAL DRAWING Surface-mount module Through-hole module Pin No. Name Functi
DS_V48SR15004_06122007 14 PART NUMBERING SYSTEM V 48 S R 150 04 N R F A Type of Product Input Voltage Number of Outputs Product Series Outp
DS_V48SR15004_06122007 2 TECHNICAL SPECIFICATIONS (TA=25°C, airflow rate=300 LFM, Vin=48Vdc, nominal Vout unless otherwise noted.) PARAMETER NOTE
DS_V48SR15004_06122007 3 ELECTRICAL CHARACTERISTICS CURVES Figure 1: Efficiency vs. load current for minimum, nominal, and maximum input voltage a
DS_V48SR15004_06122007 4 ELECTRICAL CHARACTERISTICS CURVES For Negative Remote On/Off Logic Figure 4: Turn-on transient at full rated load current
DS_V48SR15004_06122007 5 ELECTRICAL CHARACTERISTICS CURVES Figure 10: Test set-up diagram showing measurement points for Input Terminal Ripple C
DS_V48SR15004_06122007 6 EMC Test Result Test result is in compliance with EN55022 class B as shown below. Average mode, @ Vin = 48V, Iout=4.4
DS_V48SR15004_06122007 7 Soldering and Cleaning Considerations Post solder cleaning is usually the final board assemblyprocess before the board
DS_V48SR15004_06122007 8 FEATURES DESCRIPTIONS Over-Current Protection The modules include an internal output over-current protection circuit, wh
DS_V48SR15004_06122007 9 Figure 19: Circuit configuration for trim-up (increase output voltage) If the external resistor is connected between
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